Used for texturing& cleaning of mono crystalline wafers.
Process Flow:
Saw damage removal→Pre-cleaning→Mono-texturing→Post-cleaning/O3 cleaning→Acid cleaning→Hot water drying→Drying (for reference only)
• Throughput:600pcs/batch,12000pcs/h——210 wafer(100pcs cassette),720pcs/batch,15000pcs/h——182 wafer(120pcs cassette).
• Process bath circulation volume adjustable.
• Uniform pyramids texture, etch depth adjustable.
• With clean dry area and self-clean dry system.
• Low H2O2 consumption.
• Quick inline bath change.
• Available with MES, RFID system, inline weight testing optional.