COM-HPC computer-on-module SOM-COM-HPC-A-TGL-H
11th Generation Intel® Core™Intel® Xeon® W-11000EIntel® Xeon® vPRO®

COM-HPC computer-on-module
COM-HPC computer-on-module
COM-HPC computer-on-module
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Characteristics

Form factor
COM-HPC
Processor
Intel® Xeon® vPRO®, Intel® Xeon® W-11000E, 11th Generation Intel® Core™
Ports
HDMI, DisplayPort, USB 2.0, USB 3.0, USB 3.2, Mini PCIe, DDR4 SO-DIMM
Operating system
Linux, Yocto, Windows 10 IoT Enterprise, Android
Other characteristics
embedded
Applications
industrial

Description

COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® (formerly Tiger Lake-H) Processors for FuSa applications Graphics Integrated Iris Xe Graphics Core Gen12 architecture, with up to 32 Execution Units and up to 2 VDbox MPEG2, WMV9, AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP9, AV1 HW decoding, up to 8k60. AVC/H.264, HEVC/H.265, JPEG, VP9 HW encoding, up to 8k30 Support up to 4 independent displays. Audio SoundWire and I2S Audio Interface Serial Ports 2x legacy UARTs, managed by the Embedded Controller Other Interfaces - 2x 4-lane CSI-2 interfaces, optional SPI, eSPI, SM Bus, 2x I2C, Watchdog timer, Carrier board FAN Control Management signals, ACPI signals, Safety Status signals Deep Sleep / Battery support Optional TPM 2.0 module on-board 12x GPIOs Power Supply +8VDC .. +20VDC Main power supply +5V stand-by Operating Temperature 0°C ÷ +60°C (Commercial version) -40°C ÷ +85°C (Industrial Range) Dimensions - 120 x 95 mm (COM-HPC® Size A Form factor, Client pinout)

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