The automotive power module platform
eMPack® - Concept for the Future of eMobility with High-Performance Power Electronics
The transition of complete car platforms to full electric battery vehicle architectures is progressing rapidly. These architectures will demand scalable power electronics solutions for electric drive systems (EDS) that are capable of realizing a wide performance range in an economic way, resulting in an important competitive advantage to vehicle manufacturers.
SEMIKRON’s new power module platform eMPack, which is based on a single module concept, is in development for EDS inverter architectures covering a power range from 100kW up to 750kW. eMPack covers 400V and 800V battery system applications and is available in Silicon IGBT as well Silicon Carbide MOSFET technology.
The combination of Silicon Carbide technology with SEMIKRON’s fully sintered, low stray inductance Direct Pressed Die Technology (DPD) enables unmatched power densities combined with high reliability for automotive application.
Silicon Carbide MOSFET and Silicon IGBT options
750V/1200V compatible package delivering up to 900ARMS
Double Sided Sintering package enabling automotive grade reliability
Low thermal resistance thanks to DPD technology
Flexible cooler arrangements
2.5nH package stray inductance including terminals
Simplified mounting concept all from top