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Laser micro-machining machine SFP1313

Laser micro-machining machine - SFP1313 - Senfeng Laser USA Inc.
Laser micro-machining machine - SFP1313 - Senfeng Laser USA Inc.
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Characteristics

Type
laser
Power

500 kW
(679.81 hp)

Description

Scanning Speed: ≤3280′ /s Scanning Repeat Positioning Accuracy: ±5μm Laser high-speed micro-machining is one of the indispensable, and widely used laser methods in micro-holes processing. With the reduction of the thickness of target material, and the increase of hole matrix density, the traditional machining and galvanometer scanning cannot reach the expected speed and accuracy. Compared with the conventional galvanometer scanning device, high-speed polygon mirror scanning with nanosecond high repetition rate laser can effectively realize high-speed laser precision micro-hole arrays and solve the research projects in great demand. TECHNICAL PARAMETERS Machine Size: 82.2″*71.6″*78.7″ Workbench Size: 15.74″*15.74″ Laser Power(w): 500 Laser Wavelength(nm): 1064 Laser Pulse Width(ns): 30/60/120/240 Laser Frequency(kHz): 2000/1000/500/500 Diameter of Focused Spot(μm): ≤40 Effective Focal Length: 16.53″ Scanning Range: 11.8″*11.8″ Scanning Speed: ≤2000’/s Scanning Line Frequency(Hz): 1600 Scanning Repeat Positioning Accuracy(μm): ±5μm Processing Methods: Linear mode, dot matrix mode, bmp mode Positioning Method: Polygon mirror scanner is matched with mechanical shaft PROCESSING METHODS Laser lattice scanning Laser linear scanning High-speed BMP bitmap processing Laser drilling Laser linear cutting High density micro-hole array processing laser beam grooving
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.