Die-attach die bonder ACCμRA M

manualflip-chiphigh-accuracy

The ACCμRA M is a manual Flip-Chip Bonder that permits to reach ± 3 μm post-bond accuracy. The only motorized axis is the arm, which controls precisely the bonding force. Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process. The ACCμRA M, more than a pick-and-place system, offers thermocompression and reflow capabilities. It is the perfect equipment for universities and R&D institutes. • ± 3 μm post-bond accuracy • Small footprint • Manual machine • Easy to use • Open platform • R&D oriented