Cleaning atmospheric plasma generator Ontos series

OEMstand-alone

The OntosTT, proposed in 2 versions – 200 mm and 300 mm , is a table-top semi-automatic atmospheric plasma system for surface preparation. 2 sizes of plasma head are available – 25 mm and 40 mm. It provides a simple, effective, clean surface modification method which does not require the throughput-robbing vacuum chamber associated with traditional plasma systems. It performs this surface modification without ion bombardment and without the cross-contamination issues often associated with conventional plasma systems. The OEM version of the ONTOS plasma head is available for integration into third party equipment. 3 sizes of plasma head are available – 10 mm, 25 mm and 40 mm. The OntosIS system is available on the FC300 Flip-Chip Bonder. • Downstream radical chemistry only • CMOS safe, detector safe • Fast process – continuous throughput capable • Non-toxic, dry process. OSHA and EPA-friendly • Surface preparation for bonding • Photoresist residue removal • Photomask cleaning • Native oxide removal from semiconductor surfaces • Organic contamination removal prior to adhesive bonding • Pre-plating surface preparation •