Wisman's EC series of software-driven electrostatic sucker power supplies provide a range of features to meet a wide range of demanding applications. The instrument uses Wisman amplifier technology, which has been shown to increase efficiency and throughput by up to three times that of other power sources. Reduce backside gas errors, improve throughput and eliminate wafer stick/burst problems; Control parameters such as overcurrent, presence of wafer and wafer clamp thresholds, clamp voltage, offset voltage, and internal or external amplitude/offset controls; The versatility of amplitude/offset and output control during adjustment; Control output using rear panel I/O, serial computer commands, or front panel controls; Configures custom clamp and clamp removal sequences and waveforms. The versatile and trusted performance of Wisman's EC allows for use in multiple unique tools and processes without adding new costs to each unique tool or process in the facility.
Product features:
Lockable front panel control interface;
Each unit is provided with a traceable calibration certificate;
Supports Coulombic and Johnsen-Rahbek ESC technologies;
This section describes how to upload the configuration file of an electrostatic chuck to the device and store it in the device using a user-friendly software interface;
Wafer detection includes wafer free, wafer presence, or wafer clamped state;
Application:
Electrostatic driven material handling
Semiconductor wafer processing
Non-mechanical transfer of flat plates or other processed materials sensitive to mechanical handling