DC/DC power supply ECD

ISO

Application Areas: Electrostatically driven material handling,Semiconductor wafer processing,Non-mechanical transfer of flat sheets or other processed materials sensitive to mechanical handling. Wisman's ECD series of software-driven electrostatic chuck power supplies offer a range of features to meet a wide variety of demanding applications. The instrument incorporates Wisman amplifier technology, which has been shown to increase efficiency and throughput by as much as three times that of other power supplies. Reduce backside gas errors, increase throughput and eliminate wafer sticking/popping issues; control parameters such as overcurrent, wafer presence and wafer clamp thresholds, clamp voltage, offset voltage, and internal or external amplitude/offset control; versatility in amplitude/offset and output control during adjustment; control output using rear panel I/O, serial computer commands, or front panel controls; configure custom clamping and declamping sequences and waveforms. The versatile and trusted performance of Wisman's ECD allows for use in a wide range of unique tools and processes without adding new costs for each unique tool or process in the facility. Features: Lockable front panel control interface. Each unit is supplied with a traceable calibration certificate. Supports Coulombic and Johnsen-Rahbek ESC technologies. Electrostatic chuck profiles are uploaded and stored to the device and stored internally through a user-friendly software interface. Wafer detection including no wafers, wafers present or wafer clamping status. Characteristic description: Voltage display: Proportional: 1V/ 300 V B-phase DC: accuracy better than 0.5% of full scale