UV laser marking machine was developed using 355nm UV laser. The machine uses third-order cavity frequency multiplication technology compared with an infrared laser, 355 UV light focusing spot is extremely small, can be Reducing the mechanical deformation of the material to a great extent and having a small effect on the processing heat.
UV Laser Marking Machine description
UV laser marking machine was developed using 355nm UV laser. The machine uses third-order cavity frequency multiplication technology compared with infrared laser, 355 UV light focusing spot is extremely small, can be Reducing the mechanical deformation of the material to a great extent and having a small effect on the processing heat, because it is mainly used for superfine marking and engraving, and is particularly suitable for marking foods, pharmaceutical packaging materials, micropores, high-speed division of glass materials, and silicon Wafers are used in complex graphic cutting applications.
UV Laser Marking Machine advantage
1、Due to the extremely small focused spot and the small heat-affected zone of the UV laser, ultra-precision marking and special material marking can be performed. This is the preferred product for the masking effect.
2、Not only the beam quality is good, the focused spot is smaller, superfine marking can be realized, the application scope is more extensive, the heat-affected zone is extremely small, no thermal effect is generated, no problem of burning of the material occurs, the marking speed is fast, and the efficiency is high; Stability, small size, low power consumption and other advantages.