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Data connector MCC series
PCBcircularcrimp

data connector
data connector
data connector
data connector
data connector
data connector
data connector
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Characteristics

Type
data
Format
PCB
Shape
circular
Connection type
crimp, push-pull
Electrical characteristics
high-density
Product applications
plug, solder, industry
Domain
for industrial applications, for military applications, for medical applications, for the automotive industry
Protection class
IP68, IP50
Other characteristics
compact
Operating temperature

Max.: 250 °C
(482 °F)

Min.: -55 °C
(-67 °F)

Description

The “F” series is one of the most common and widely used connector lines in the push pull industry.​ Can be found in most industries for a wide variety of applications.​ Offers a wide variety of plug and receptacle styles. ​ Smaller and more compact than the I series.​ With the right assembly and potting technique they can be IP68 in unmated condition​. Main Feature Push-Pull self-latching. 4 Sizes. 2 to 32 contacts. Solder, PCB & crimp contacts. Multiple keying options. Temp. range -55°C to 250°C. IP50 & IP68 selected models. Current rating: 1.5 to 30A. Resistant to salt spray over 96 hrs. Durability: >5,000 cycles. The “H” series is a self-cleaning circular push pull latching connector.High-density assembly.4 kinds of positioning anti-misinsert. The “U” series is suitable for military miniaturization and portable electronic communication equipment.Rugged in harsh environments and not easy to damage. FX series is suitable for high-density installation, limited space that is difficult to rotate or pull in/out. they are widely used in radio equipment, infantry equipment, reinforced computer, medical equipment, test and detection equipment, audio and video equipment, digital equipment both in military and civilian fields.
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.