PVD deposition machine RTSP1000
PECVDmagnetron sputteringarc evaporation

PVD deposition machine
PVD deposition machine
PVD deposition machine
PVD deposition machine
PVD deposition machine
PVD deposition machine
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Characteristics

Method
PVD, PECVD
Technology
magnetron sputtering, arc evaporation, ion beam-assisted
Deposition type
thin-film, diamond-like carbon
Other characteristics
vacuum
Applications
for the microelectronics industry, for photovoltaic modules

Description

Closed field unbalanced magnetron sputtering deposition system, Unbalanced Magnetron Sputtering Ion Plating Unbalanced and closed field magnetron processes have all the advantages of planar magnetrons. Additional advantages and disadvantages are: -Additional ion bombardment resulting in dense, adherent films -Ion assist and substrate cleaning possible -Improved tribological, wear and corrosion resistant films -Amenable to multilayer, superlattice, nanolaminant and nanocomposite films -Poorer materials usage -More complex cathode configuration/expense Unbalanced and closed field magnetron sputtering revolutionized properties achievable by magnetron sputtering processes. As successful with improved thin film tribological, corrosion resistance and optical properties as this technology was, improvements in magnetron technology had just begun. Next Blog we move onto rotating and cylindrical magnetron processes and resulting thin film applications.

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