PVD deposition machine RTAC1215-SP

magnetron sputteringantibacterialvacuum

Ceramic Radiating Substrate Cooper Magnetron Sputtering Coating Plant / Ceramic Chips Direct Plating Copper Sputtering Equipment Cooper Magnetron Sputtering Coating Plant on Ceramic Radiating Substrate The DPC process- Direct Plating Copper is an advanced coating technology applied with LED / semiconductor / electronic industries. One typical application is Ceramic Radiating Substrate. Cooper conductive film deposition on Al2O3, AlN, Si, Glass substrates by PVD vacuum sputtering technology, compared with traditional manufacturing methods: DBC LTCC HTCC, the features: 1. Much lower production cost. 2. Outstanding thermal management and heat-transfer performance 3. Accurate alignment and pattern design, 4. High circuit density 5. Good adhesion and solderability Royal technology team assisted our customer to develop the DPC process successfully with PVD sputtering technology. Due to its advanced performance, the DPC substrates are widely used in various applications: High brightness LED to increase the long life time because of its high heat radiation performance, Semiconductor equipment, microwave wireless communication, military electronics, various sensor substrates, aerospace, railway transportation, electricity power , etc RTAC1215-SP equipment is exclusively designed for DPC process which get the cooper layer on substrates. This equipment utilizes PVD physical vapor deposition principle, with multi-arc ion plating and magnetron sputtering techniques to obtain the ideal film with high density, high abrasion resistance, high hardness and strong binding in high vacuum environment. It is the crucial step for rest of DPC process.