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PVD deposition machine RTEP1616-SPDCsputteringthermal evaporationmetalized film
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Characteristics
- Method
- PVD
- Technology
- sputtering, thermal evaporation
- Deposition type
- metalized film
- Other characteristics
- vacuum
- Applications
- for electronics
Description
Shielding coating used in cell phone case Cu Copper PVD Thermal Evaporation Coater, Copper Sputtering Deposition System
RTEP1616-SPDC PVD copper vacuum metallizing machine consist of thermal evaporation and sputtering deposition sources, vacuum coating chamber , vacuum pumping system, deposition system, cooling system , electrical control system , workpiece rotating rack.
Thermal Evaporation and Sputtering Metalizing Machine Features:
Dual chamber for independent loading operations.
Four types of coating process modes available for selection.
Option: RF generators or magnetron sputtering source can be installed for surface coating.
Uses planetary rotation mechanism to achieve good film uniformity on curved surface substrates.
Thermal Evaporation and Sputtering Metallizing Machine Application:
Plastic cutlery, Ceramic, Electronics product, Cellphone housing, NCVM applications, Decorative items, Metallic finish.
Coating Function:Protective coating, functional coating.
Film: Copper conductive film, Metal film, semi-transparent film, Mobile phone EMI, NCVM, Dielectric film.
Substrates:plastic parts, construction material, arts&craft, electronics products etc
Catalogs
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.