PVD deposition machine RTSP1215-MF

nanoparticlefor electronicsfor lighting

The PVD machine model: RTSP1215-MF is designed and developed to deposit TiN gold coating on Copper circuit board. The TiN thin film generated in high vacuum environment, which highly enhanced the uniformity and purity. Copper Circuit Board TiN PVD Coating Machine design features: 1. 8-sides chamber with equal sizes mounting flanges, which can assemble and exchange Ion source and Sputtering cathodes or Arc cathodes flexiblely based on the coating processes demand. 2. Compact design which only occupy 20sqm; 3. Ion source for plasma cleaning pre-treatment and Ion-beam assisted deposition to enhance the film adhesion. 4. High pumping speed package and stable configuration, the magnetically suspension molecular pumps can be mounted in any direction. Copper Circuit Board TiN PVD Coating Machine Specifications Performance 1. Ultimate Vacuum Pressure: better than 5.0×10-6 Torr. 2. Operating Vacuum Pressure: 1.0×10-4 Torr. 3. Pumpingdown Time: from 1 atm to 1.0×10-4 Torr≤ 3 minutes ( room temperature, dry, clean and empty chamber) 4. Metalizing material (sputtering + Arc evaporation): Ni, Cu, Ag, Au, Ti, Zr, Cr etc. 5. Operating Model: Full Automatically /Semi-Auto/ Manually