PVD deposition machine RTAC1612-SPMF
magnetron sputteringarc evaporationthin-film

PVD deposition machine - RTAC1612-SPMF - Shanghai Royal Technology Inc. - magnetron sputtering / arc evaporation / thin-film
PVD deposition machine - RTAC1612-SPMF - Shanghai Royal Technology Inc. - magnetron sputtering / arc evaporation / thin-film
PVD deposition machine - RTAC1612-SPMF - Shanghai Royal Technology Inc. - magnetron sputtering / arc evaporation / thin-film - image - 2
PVD deposition machine - RTAC1612-SPMF - Shanghai Royal Technology Inc. - magnetron sputtering / arc evaporation / thin-film - image - 3
PVD deposition machine - RTAC1612-SPMF - Shanghai Royal Technology Inc. - magnetron sputtering / arc evaporation / thin-film - image - 4
PVD deposition machine - RTAC1612-SPMF - Shanghai Royal Technology Inc. - magnetron sputtering / arc evaporation / thin-film - image - 5
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Characteristics

Method
PVD
Technology
magnetron sputtering, arc evaporation
Deposition type
thin-film, metalized film , diamond-like carbon
Other characteristics
vacuum, short-cycle
Applications
for electronics, for household appliances

Description

MF/DC Magnetron Sputtering Deposition Equipment, PVD Sputtering on Flatware, Stainless steel electronic components Summary: PVD arc evaporation perfectly combined with MF sputtering technology, generate the high end quality functional and aesthetic coatings on products surface. Why MF Sputtering? Compared with DC and RF sputtering, Mid-Frequency sputtering has become a main thin film sputtering technique for mass production of coating, particularly for the film deposition of dielectric and non-conductive film coatings on surfaces such as optical coatings, solar panels, multiple layers, composite material film etc. It is replacing RF sputtering due to it operates with kHz rather than MHz for a much faster deposition rate and also can avoid the Target poisoning during compound thin film deposition like DC. MF sputtering targets always existed with two-sets. Two cathodes are used with an AC current switched back and forth between them which cleans the target surface with each reversal to reduce the charge build up on dielectrics that leads to arcing which can spew droplets into the plasma and prevent uniform thin film growth--- which is what we called Target Poisoning. With MF sputtering system, we can get graphite color, the LAB data: ( L: 30~35). A:-0.04, B:08 Key Words: Consumer Electronics PVD Decorative Coating, Stainless Steel Flatware PVD decoration, Pearl high glossary PVD coating, finger ring black plating, medical instrument DLC coating, Corrosion and wear resistance PVD films, high vacuum metallizer.

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