PVD deposition machine RTSP800-Au

sputteringthin-filmvacuum

Gold Coated Glass Slides and Silicon Wafers use the PVD process of DC magnetron sputtering to deposit Au metal thin film layer on substrates, like: glass slide, Silicon wafers, metal jewelry, steel, glass and ceramic wares etc. Except Au sputtering, it can also sputter Ag Silver, Cu Copper, Al Aluminum, Cr Chrome, SS stainless steel 316L etc. for conductive film or high luxury decoration applications. The gold sputtering layer features: 1. Ti or Cr Adhesion layer between substrates and gold layer is strongly recommended to improve the adhesion; 2. The Gold layer thickness: ranges from 10~100nm based on different optical applications. 3. The roughness (RMS - root mean square) < 40Å is expected for most of the applications. For certain scanning probe applications a lower roughness might be required, generally 1.5 ~ 4 nm. 4. Gold sputtering layer surface purity: a clean surface is required for applications that employ gold surface modifications. Depending on the PVD process used, level of vacuum in the system, original purity of the gold source, and history of metals used in the particular system the level of gold thin film purity can vary greatly. As an advanced coating technology which can reduce up to 80% production cost and the most important is the great surface finishing. Au Gold Mangetron Sputtering System Hightlights: ROYAL Technology Ag gold sputtering machine is available for manufactures who are looking for high productivity and simple coating solutions. Robust design, large batches, fast cycle, flexible coating processes are the basic design concepts ROYAL Team has been pursuing.