Sputtering coating machine RTSP-400

laboratory

1. The UHV sputtering system is equipped with DC sputtering guns to deposit the semi-conductive and non-conductive materials ( Si, SiO2, Al2O3, Si3N4 ,Cr2O3,ITO and other materials). RF sputtering gun to deposit the conductive material Aluminum, Silver, Gold etc. DC and RF power supply sources can be exchanged flexible. 2. The UHV sputtering system applications of Conductive coatings on polymeric materials, wood, fabrics at low temperatures less than 100 ℃ Application of conductive coatings on glass, ceramics and other dielectric materials. 3. Technical Performance: 3. 1 Ultimate Vacuum Pressure: better than 5.0×10-6 Torr. 3. 2. Operating Vacuum Pressure: 1.0×10-4 Torr. 3. 3. Pumpingdown Time: from 1 atm to 1.0×10-4 Torr≤ 3 minutes ( room temperature, dry, clean and empty chamber) 3. 4. Metalizing material (sputtering ) Al, Cr, Sn, Ti, SS, Cu… etc. 3. 5. Operating Model: Full Automatically /Semi-Auto/ Manually 4.​ Structure The UHV Sputtering vacuum coating machine contains key completed system listed below: 1. Vacuum Chamber 2. Rouhging Vacuum Pumping System (Backing Pump Package) 3. High Vacuum Pumping System (Diffusion Pump) 4. Electrical Control and Operation System 5. Auxiliarry Facility System (Sub System) 6. Deposition System