Antenna printed circuit board HDI

for automotive applications

SYE is building high density interconnect (HDI) printed circuit boards since more than 30 years. With opening DongCheng plant in 2014 we bring HDI in a high automated production line into mass production. Since then HDI printed circuit boards have found their way in nearly every branch – even in automotive products. SYE can offer the full range of technologies, from 1+2+1 design up to anylayer boards. SYE support HDI technologies as: Edge plating for shielding and ground connection Copper-filled microvias Stacked and staggered microvias Cavities, countersunk holes or depth milling Copper coin Technology for local heat dissipation Solder resist in black, blue, green, etc. Minimum track width and spacing in mass production around 50μm Low-halogen material in standard and high Tg range Low-DK/Df material for antenna designs All recognised printed circuit board industry surfaces available in house