Polymer adhesive DM-6679
for plasticssingle-componentlight-cured

Polymer adhesive - DM-6679	 - Shenzhen DeepMaterial Technologies Co., Ltd - for plastics / single-component / light-cured
Polymer adhesive - DM-6679	 - Shenzhen DeepMaterial Technologies Co., Ltd - for plastics / single-component / light-cured
Polymer adhesive - DM-6679	 - Shenzhen DeepMaterial Technologies Co., Ltd - for plastics / single-component / light-cured - image - 2
Polymer adhesive - DM-6679	 - Shenzhen DeepMaterial Technologies Co., Ltd - for plastics / single-component / light-cured - image - 3
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Characteristics

Chemical composition
polymer
Type of substrate
for plastics
Number of components
single-component
Technical characteristics
UV-polymerized, light-cured
Applications
for bonding, for filling applications, for displays, for motors
Working temperature

Max.: 150 °C
(302 °F)

Min.: -55 °C
(-67 °F)

Shear strength

18 N

Description

DeepMaterial's multi-purpose UV-curing adhesive can quickly polymerize and cure under ultraviolet radiation, which helps to greatly improve production efficiency. Widely used in bonding, wrapping, sealing, reinforcing, covering and sealing purposes. DeepMaterial multi-purpose UV curing adhesive is a one-component solvent-free product, which can be cured in a few seconds under UV or visible light. It has a fast curing speed, high bonding strength, large curing depth, good toughness, and anti-yellowing. DeepMaterial adheres to the research and development concept of "market priority, close to the scene", and strives to fully meet the current rapid development of electronic products, update the current situation of itera- tion, and continuously improve products, fully meet the requirements of high-speed assembly process of electronic products, and be compatible with solvent-free environmental protection technology, To ensure that customer's production cost and efficiency are improved and the production concept of environmental protection and high efficiency is realized. The DeepMaterial multi-purpose UV curing adhesive product line covers the main applications of structural bonding. High thixotropy, suitable for filling and bonding of large gaps, suitable for materials with low surface energy and difficult to stick. Surfaces such as PTFE, PE, PP are low-energy surfaces.

Other Shenzhen DeepMaterial Technologies Co., Ltd products

UV Curing UV Adhesive

*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.