Polymer adhesive DM-6675
glasssingle-componentlight-cured

polymer adhesive
polymer adhesive
polymer adhesive
polymer adhesive
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Characteristics

Chemical composition
polymer
Type of substrate
glass
Number of components
single-component
Technical characteristics
transparent, light-cured
Applications
for bonding, for displays
Working temperature

Max.: 150 °C
(302 °F)

Min.: -55 °C
(-67 °F)

Shear strength

11 N

Description

DeepMaterial's multi-purpose UV-curing adhesive can quickly polymerize and cure under ultraviolet radiation, which helps to greatly improve production efficiency. Widely used in bonding, wrapping, sealing, reinforcing, covering and sealing purposes. DeepMaterial multi-purpose UV curing adhesive is a one-component solvent-free product, which can be cured in a few seconds under UV or visible light. It has a fast curing speed, high bonding strength, large curing depth, good toughness, and anti-yellowing. DeepMaterial adheres to the research and development concept of "market priority, close to the scene", and strives to fully meet the current rapid development of electronic products, update the current situation of itera- tion, and continuously improve products, fully meet the requirements of high-speed assembly process of electronic products, and be compatible with solvent-free environmental protection technology, To ensure that customer's production cost and efficiency are improved and the production concept of environmental protection and high efficiency is realized. The DeepMaterial multi-purpose UV curing adhesive product line covers the main applications of structural bonding. It is a unitized, UV-curable adhesive, specially designed for pin bonding applications of LCD terminals.

Catalogs

Other Shenzhen DeepMaterial Technologies Co., Ltd products

UV Curing UV Adhesive

*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.