Polymer adhesive DM-6432
for plasticsglasssingle-component

Polymer adhesive - DM-6432 - Shenzhen DeepMaterial Technologies Co., Ltd - for plastics / glass / single-component
Polymer adhesive - DM-6432 - Shenzhen DeepMaterial Technologies Co., Ltd - for plastics / glass / single-component
Polymer adhesive - DM-6432 - Shenzhen DeepMaterial Technologies Co., Ltd - for plastics / glass / single-component - image - 2
Polymer adhesive - DM-6432 - Shenzhen DeepMaterial Technologies Co., Ltd - for plastics / glass / single-component - image - 3
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Characteristics

Chemical composition
polymer
Type of substrate
for plastics, glass
Number of components
single-component
Technical characteristics
UV-polymerized, heat-cured, dual-curing, thermally-conductive
Applications
for bonding, for electronics

Description

DeepMaterial's multi-purpose UV-curing adhesive can quickly polymerize and cure under ultraviolet radiation, which helps to greatly improve production efficiency. Widely used in bonding, wrapping, sealing, reinforcing, covering and sealing purposes. DeepMaterial multi-purpose UV curing adhesive is a one-component solvent-free product, which can be cured in a few seconds under UV or visible light. It has a fast curing speed, high bonding strength, large curing depth, good toughness, and anti-yellowing. DeepMaterial adheres to the research and development concept of "market priority, close to the scene", and strives to fully meet the current rapid development of electronic products, update the current situation of itera- tion, and continuously improve products, fully meet the requirements of high-speed assembly process of electronic products, and be compatible with solvent-free environmental protection technology, To ensure that customer's production cost and efficiency are improved and the production concept of environmental protection and high efficiency is realized. The DeepMaterial multi-purpose UV curing adhesive product line covers the main applications of structural bonding. Dual-curing adhesives are specially designed for the assembly of temperature-sensitive electronic components. The formula of this product is to perform initial curing under ultraviolet radiation, and then perform secondary thermal curing to achieve the best performance.
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.