Epoxy adhesive DM-6320

glasssingle-componentchemical-resistant

DeepMaterial offers new capillary flow underfills for flip chip, CSP and BGA devices. DeepMaterial's new capillary flow underfills are high fluidity, high-purity, one-component potting materials that form uniform, void-free underfill layers that improve the reliability and mechanical properties of components by eliminating stress caused by solder materials. DeepMaterial provides formulations for fast filling of very fine pitch parts, fast cure capability, long working and lifespan, as well as the reworkability. Reworkability saves costs by allowing removal of the underfill for reuse of the board. Flip chip assembly requires stress relief of the welding seam again for extended thermal aging and cycle life. CSP or BGA assembly requires the use of an underfill to improve the mechanical integrity of the assembly during flex, vibration or drop testing. DeepMaterial's flip-chip underfills have high filler content while maintaining fast flow in small pitches, with the ability to have high glass transition temperatures and high modulus. Our CSP underfills are available in varying filler levels, selected for the glass transition temperature and modulus for the intended application. The reusable underfill is specially designed for CSP, WLCSP and BGA applications. Its formula is to cure quickly at moderate temperatures to reduce stress on other parts. The material has a higher glass transition temperature and higher fracture toughness, and can provide good protection for solder joints during thermal cycling.