Epoxy adhesive DM-7180

for metalsingle-componenthigh-temperature

DeepMaterial Conductive silver adhesive is a one-component modified epoxy/silicone adhesive developed for the integrated circuit packaging and LED new light sources, flexible circuit board (FPC) industries. After curing, the product has high electric conductivity, heat conduction, high temperature resistance and other high reliable perfor- mance. The product is suitable for high-speed dispensing, dispensing good type protection, no deformation, no collapse, no diffusion; The cured material is resistant to moisture, heat and high temperature. Can be used for crystal packaging, chip packaging, LED solid crystal bonding, low temperature welding, FPC shielding and other purposes. Mainly used in IC chip bonding. Designed for heat-sensitive applications that require low-temperature curing. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive dispensing, has a good adhesive output speed, and improves the production cycle.