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- Packing and Packaging
- Protective film
- Shenzhen DeepMaterial Technologies Co., Ltd
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Packaging film DM-208 series protectivefor the electronics industry
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Characteristics
- Function
- for packaging, protective
- Application field
- for the electronics industry
- Thickness
170 µm
Description
The product uses PO as the surface protection material, mainly used for QFN cutting, SMD microphone substrate cutting, FR4 substrate cutting (LED).
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Semiconductor Protective Film
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