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Multilayer printed circuit board
for communication module

Multilayer printed circuit board - Shenzhen Fast PCB Technology Co., Ltd. - for communication module
Multilayer printed circuit board - Shenzhen Fast PCB Technology Co., Ltd. - for communication module
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Characteristics

Options
multilayer
Applications
for communication module

Description

ENIG surfacement, 2.5mm finished board thickness, Size: 414*334mm, Material: Nelco N4000-13EPSI , Resin plug hole+back drill
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.