LED light module GT-FC500

High Intensity Small LES 500W Flip Chip COB Module GT-FC500(SP1010) Power: 500W Luminous area:12.84*12.84mm RoHS compliant Product Description High Reliability and Stability Ceramic base with flip chip mounted, no gold wire bonding High heat conductivity red copper substrate High temperature eutectic welding technique Reliable raw materials applied with super fast heat transfer Patented phosphor coating techonology Outstanding Projecting Performance High power & lux density with super even light distribution Minimum distance in-between chips to achieve surface emitting effect Extremely small LES optimized for focused lighting purpose Flexible Application Features Equipped with temperature sensor and quick connector A wide power range from 10W to 800W optional Application:stage light, projector, searchlight and long-distance lighting applications,etc