Thermal pad HCF-013V3

HCF-013V3 is a new type of ultrathin thermal pad with ultra-low thermal resistance. The thermal pad is fabricated by combining high thermal conductive two-dimensional materials and silicone. We take advantage of an advanced technology to arrange the two-dimensional materials in the polymer matrix in an orderly manner to form a good thermal conductive path, which greatly improves the heat conductive efficiency. It is especially suitable for 5G base stations, chips and other equipment that need high heat flux. In addition, the ultra-thin thermal pad has many advantages ,such as high resilience, high compressibility, low density, excellent stability , etc., which can be used as a potential alternative materials of thermal grease.