- Electricity - Electronics
- Electronic Component
- Multilayer printed circuit board
- Shenzhen STHL Technology Co.,Ltd
Multilayer PCB
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Characteristics
- Options
- multilayer
Description
Multilayer PCB Manufacturing Process
The manufacturing process of multilayer PCBs is detailed and requires special precautions. It involves steps such as designing the PCB layout, making the inner layer core, lamination, cutting, inner dry film application, black oxidation, lamination, mechanical drilling, metalizing the through holes, dry film and pattern plating, solder mask application, silkscreen, surface finishing, profiling, E-TEST, and final inspection.
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SMT Assembly
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.