Multilayer PCB

for communication module4-layers

Archecircuit Multilayer PCB OSP for Networking and Communication System Dimension: 270.00*150.00 mm Plate thickness: 1.6mm Plate: FR-4 Surface finish: OSP Application: Networking & Commnunication Material - FR-4 (Tg 135 / Tg140 / Tg155 / Tg170/ As you required) Aluminum Rogers / PTFE Teflon Surface Finishing - HASL/OSP/Immersion Gold(FR4) HASL(Aluminum) Printed Wiring: - Pattern Plating Max. Dimension - 660×475mm Min. Dimension - 5×5mm Finished board thickness: - 0.2mm-3.0mm Thickness Tolerance: ( Thickness≥1.0mm) - ± 10% Thickness Tolerance: ( Thickness<1.0mm) - ± 0.1mm Finished Outer Layer Copper - Double sided: 1 oz/2 oz/3 oz/4 oz Multilayer: 1 oz/2 oz Finished Inner Layer Copper - 0.5 oz/1 oz/2 oz Drill Hole Size - Double sided: 0.20mm – 6.30mm Multilayer: 0.15mm-6.3mm Drill Hole Size Tolerance - Pad Hole: +0.13/-0.08mm Pressure Welding Hole: ±0.05mm Blind/Buried Vias - Don’t support Min. Via Hole Size/Diameter - 1 & 2 Layer: 0.3mm(Via hole size) / 0.5mm(Via diameter) Multi-Layer: 0.15mm(Via hole size) / 0.25mm(Via diameter) Via diameter should be 0.1mm(0.15mm preferred) larger than Via hole size Preferred Min. Via hole size: 0.2mm Min. Plated Slots - 0.35mm Min. Non-Plated Slots - 0.65mm