BGA Rework Station ZM-R5860
• - Entry Level BGA Rework Ststion
• - Stable Hot Air Heating System
• - Lower Heater Adjustable
• - Carbon Fiber Infrared Pre-heater
• - HD Touch Screen HMI Interface
• - Manual Placement, Desoldering
• - More modular panels observation point setting
• - Real-time temperature monitoring and over heating protection.
• - Emergency Stop Function
• - Add a side camera, more clearly observe the rework process(Optional)
Application
Suitable for SMD(BGA, QFP etc.) repair, support IC chips min size. 2mm * 2mm, max. 50mm * 50mm.