X-ray inspection system X5600

automaticfor the electronics industrycomputer-controlled

PCB X-Ray inspection system X5600 • - Miniaturized equipment, easy to install and operate • - Applicable to Chip, LED, BGA/CSR Wafer, SOP/QFN, SMT and PTU packaging, Sensors, Connectors, and Precision Castings inspection. • - High resolution design to get the best image in a very short time. • - Infrared automatic navigation and positioning function can select the shooting location quickly. • - CNC inspection mode which can quickly and automatically inspect multi-point array. • - Inclined multi-angle inspection makes it easier to inspect sample defects. • - Simple softwareoperation, low operating costs • - Long lifespan Application 1) Defect inspection in IC encapsulation, e.g.: layer separation, cracking, void, and line integrity. 2) Measuring chip size, measuring line curvature, measuring the proportion of solder area of components. 3) Possible defects in PCB manufacturing processes, e.g.: misalignment, solder bridge and open. 4) SMT solder short, cold solder, component shifted, solder insufficient, solder void inspection and measurement. 5) Defect inspection of open, short or abnormal connections that may occur in automotive wiring harnesses and connectors. 6) Inner rupture or hollow inspection in plastic or metal. 7) Battery stacking uniformity, electrode welding inspection. 8) Seed, biological material inspection etc.