X-ray inspection system X6600
automaticfor the electronics industrycomputer-controlled

X-ray inspection system - X6600 - Shenzhen Zhuomao Technology Co., Ltd. - automatic / for the electronics industry / computer-controlled
X-ray inspection system - X6600 - Shenzhen Zhuomao Technology Co., Ltd. - automatic / for the electronics industry / computer-controlled
X-ray inspection system - X6600 - Shenzhen Zhuomao Technology Co., Ltd. - automatic / for the electronics industry / computer-controlled - image - 2
X-ray inspection system - X6600 - Shenzhen Zhuomao Technology Co., Ltd. - automatic / for the electronics industry / computer-controlled - image - 3
X-ray inspection system - X6600 - Shenzhen Zhuomao Technology Co., Ltd. - automatic / for the electronics industry / computer-controlled - image - 4
X-ray inspection system - X6600 - Shenzhen Zhuomao Technology Co., Ltd. - automatic / for the electronics industry / computer-controlled - image - 5
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Characteristics

Technology
X-ray
Operational mode
automatic
Applications
for the electronics industry
Other characteristics
computer-controlled

Description

X-Ray inspection system X6600 • - SMT/Semicon/Solar/Connector/LED • - High-definition image: Slanting/Bridge/Voids/Cold Solder/Bonding wire • - 90KV 15μm closed X-ray tube,with long life,maintenance in free • - 1.3 million high resolution digital flat panel detector • - 30 degrees observation • - Color image navigation, easy to use • - Automatic programming detection and automatic analysis NG or OK • - More modular panels observation point setting Application 1) Defect inspection in IC encapsulation, e.g.: layer separation, cracking, void, and line integrity. 2) Measuring chip size, measuring line curvature, measuring the proportion of solder area of components. 3) Possible defects in PCB manufacturing processes, e.g.: misalignment, solder bridge and open. 4) SMT solder short, cold solder, component shifted, solder insufficient, solder void inspection and measurement. 5) Defect inspection of open, short or abnormal connections that may occur in automotive wiring harnesses and connectors. 6) Inner rupture or hollow inspection in plastic or metal. 7) Battery stacking uniformity, electrode welding inspection. 8) Seed, biological material inspection etc.

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