Automation software Xpedition Package

controldesignquality

Heterogeneous and homogeneous 2.5/3D IC constraint driven substrate physical implementation and manufacturing handoff. Physical implementation & manufacturing handoff Design of advanced semiconductor package interposers and substrates including FOWLP, ABF, 2.5/3D, silicon, glass core, embedded or raised bridges, System-In-Package and modules. Key features of Xpedition Package Designer Modern AI-infused User eXperience (UX) Standardized menu structures and UI/UX enabled with AI and ML to predict and recommend operations to accelerate designer productivity. Device stacking for 2.5/3D and SiP/Module Integrations Construct and manage complex device assemblies such as 3D IC, side-by-side, multiple stacks with different heights. Full support for embedded dual-sided die/devices such as interposer/bridge configurations including support for active and passive embedded devices. Comprehensive SiP Module Support Design and verify complex SiP modules in a fully supported 3D design environment. Simultaneous 2D/3D editing and DRC all within a single design tool that easily detects and avoids 3D-related design issues. Comprehensive real-time wire bonding for the most complex multi-die stacks with user-definable wire profiles with digital, analog, mixed technology support. High Performance Signal & Interface Routing Quickly implement HBM interfaces with automatic step/repeat of channels including automatic compensation for off-pitch pins. Quickly plan and route data paths with patented Sketch automated routing technology. Built-in automatic SI performance net tuning with automatic shielding of differential pairs and single-ended nets.