Visualization software Xpedition Substrate Integrator

designmanagementprototyping

Heterogeneous and homogeneous 2.5/3D IC Package Connectivity Planning, assembly prototyping, & system technology co-optimization. 2.5/3D IC Package Planning & Prototyping Early prototyping and exploration allows engineers to evaluate different ASIC/chiplet, interposer, package, and PCB integration scenarios in order to meet overall PPA, device size, routability, and cost goals prior to detailed physical implementation. Key features of Substrate Integrator Full or Partial Schematics Import IC package assembly logical connectivity can be constructed by using full or partial graphical schematics, useful for high device count designs such as SiP modules and/or the re-use/retargeting of previous designs. System-level Package Connectivity Management System connectivity management, visualization, and system-level logical verification of multi-die, multi-component, and multi-substrate IC package designs. Aggregation of Die, Chiplets & Substrates Xpedition Substrate Integrator integrates die, chiplets, and interposers from different process nodes and suppliers. Multiple formats are supported including LEF/DEF, GDS, AIF, and CSV/TXT. Hierarchical virtual die models support bidirectional ECO changes of objects under design/optimization. Silicon-package-PCB Cross Substrate Co-optimization Cross-substrate planning and co-optimization greatly improve predictability during implementation by finding and fixing issues before they become late-stage surprises. A system perspective with cross-substrate visibility improves communication and coordination through immediate feedback to decisions typically made on an individual substrate basis.