Simulation software IC Package Simulation

designmodelinganalysis

Comprehensive analysis of die/package coupling, signal integrity/PDN performance, and thermal conditions. Physical Implementation & Manufacturing Handoff Signal integrity/PDN issues are found, investigated, and validated. 3D thermal modeling and analysis predicts airflow and heat transfer in and around electronic systems. Package Simulation key features Comprehensive analysis of die/package coupling, signal integrity/PDN performance, and thermal conditions. Signal integrity/PDN issues are found, investigated, and validated. 3D thermal modeling and analysis predict airflow and heat transfer in and around electronic systems. Analysis of voltage drop & IC switching noises Power distribution networks can be analyzed for voltage drop and switching noise issues. Identify potential DC power delivery issues such as excessive voltage drop, high current densities, excessive via currents and associated temperature rise including co-simulation for signal/power/thermal impact. Results can be reviewed in graphical and report formats. Analyze signal integrity (SI) issues in the design cycle HyperLynx SI supports general-purpose SI, DDR interface signal integrity and timing analysis, power-aware analysis, and compliance analysis for popular SerDes protocols. From pre-route design exploration and “what-if” analysis through detailed verification and sign-off, all with fast, interactive analysis, ease-of-use, and integration with Package Designer. Comprehensive SERDES analysis SERDES interface analysis and optimization include FastEye diagram analysis, S-parameter simulation, and BER prediction.