Embedded PC SMI-EIPC-06

Intel® Core i5Intel® Core i7Intel® Core i3

1. Optional CPU model The optional Intel package is FCLGA1151 6th/7th generation series CPU, which can flexibly adapt to customer's product needs. 2. Optional memory capacity The memory adopts the memory slot scheme, which is suitable for conventional DDR4 notebook memory modules in the market, and flexibly adapts to customers' needs for memory. 3. Fully sealed, fanless design The entire chassis adopts a structure combining aluminum alloy and sheet metal to eliminate noise and prevent dust. The aluminum alloy fin heat dissipation design increases the passive heat dissipation effect by 50% compared with the previous traditional design. 4. No cable, modular design The internal modules are hard-connected without cables, which improves the reliability of signal conversion and assembly efficiency, while greatly improving the mean time between failures and maintenance efficiency. 5. Better anti-vibration design The fixing method of PCI/PCIE boards is more reliable than the previous traditional methods, which solves the phenomenon that the previous boards are easy to loosen and have poor contact after long-term use. ◆Intel Kabylake/Skylake Core I3/I5/I7 FCLGA1151 series CPU ◆DDR4-2133/2400MHz SODIMM memory design, up to 16GB ◆1*2.5 inch SATA3.0, support 2.5 inch hard disk (2*2.5 inch SATA3.0 can be selected before leaving the factory) ◆HDMI+VGA dual display mode, support 4K monitor ◆2*Intel I211-AT 10/100/1000M network port ◆4*USB3.0, 2*USB2.0 (built-in) ◆4*3 lines RS-232, 1*RS-485 ◆Built-in 1*MINI PCIe slot, support mSATA ◆Built-in optional 1*MINI PCIe slot, support 3G/4G/WIFI module