Embedded PC SMI-EIPC-04

Intel® Core i5Intel® Core i7Intel® Core i3

1. Optional CPU model The optional Intel package is FCLGA1151 6th/7th generation series CPU, which can flexibly adapt to customer's product needs. 2. Optional memory capacity The memory adopts the memory slot scheme, which is suitable for conventional DDR4 notebook memory modules in the market, and flexibly adapts to customers' needs for memory. 3. Fully sealed, fanless design The entire chassis adopts a combination of aluminum alloy and sheet metal structure to eliminate noise and prevent dust. The aluminum alloy fin heat dissipation design increases the passive heat dissipation effect by 50% compared with the previous traditional design. 4. The interface is more complete The interface includes 1*HDMI, 1*VGA, 2*LAN, 4*UBS3.0, 2*USB2.0, 4*3-wire RS-232, 1*RS-485, 1*spare extension switch. ◆Intel Kabylake/Skylake Core I3/I5/I7 FCLGA1151 series CPU ◆DDR4-2133/2400MHz SODIMM memory design, up to 16GB ◆1*2.5 inch SATA3.0, support 2.5 inch hard disk ◆HDMI+VGA dual display mode, support 4K display ◆2*Intel I211-AT 10/100/1000M network port ◆4*USB3.0, 2*USB2.0 (built-in) ◆4*3 lines RS-232, 1*RS-485 ◆Built-in 1*MINI PCIe slot, support mSATA ◆Built-in optional 1*MINI PCIe slot, support 3G/4G/WIFI module ◆DC 24V power supply, with anti-reverse connection and over-current protection ◆Aluminum alloy and sheet metal shell, fanless cooling design.