WLCSP test socket Volta series

WLCSP test socket - Volta series - Smiths Interconnect
WLCSP test socket - Volta series - Smiths Interconnect
WLCSP test socket - Volta series - Smiths Interconnect - image - 2
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WLCSP

Description

The unique precision afforded by Smiths Interconnect's floating spring probe designs allows for seamless deployment in testing Wafer Level Chip Scale Packages. We work closely with our customers to develop contactors which are used as probe heads in place of cantilever and traditional vertical probe card technologies. Smiths Interconnect has created thousands of probe heads for every type of device and prober. In that process, we have created a WLCSP-optimized family of spring contact probes, the Volta Series. Reliable RF signal integrity Excellent compliance and contact force Easy maintenance

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Exhibitions

Meet this supplier at the following exhibition(s):

SEMICON CHINA 2025

26-28 Mar 2025 Shanghai (China)

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    HANNOVER MESSE 2025
    HANNOVER MESSE 2025

    31 Mar - 04 Apr 2025 Hannover (Germany)

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    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.