Burn-in test socket C-Series H-Pin®

Burn-in test socket - C-Series H-Pin® - Smiths Interconnect
Burn-in test socket - C-Series H-Pin® - Smiths Interconnect
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Characteristics

Options
burn-in

Description

C-Series H-Pin® Socket is a modular burn-in socket with clamshell-style lid. The small footprint outline allows for a best-in-class range of package accommodations, from 0.5 mm body size up to 12 mm and optimal socket density per burn-in board. Features & Benefits - Design flexibility, in-house tooling and molds allow for lowest cost of test. - Extensive catalog of standard components reduces cost and lead-time. - ≥0.3 pitch accommodates a wide variety of application needs. - Optimized thermal profile to end-use specification Feature options - LCC,QFP, , QFN, LGA, BGA, and WLCSP - Spring-loaded plunger - Heat sink - HAST venting features - Integrated thermal control with heater and sensor - Reverse seating plane - Package inserts for a variety of sizes - High temperature materials for above 200 °C applications H-Pin Technology Utilizing the H-Pin in the C-Series socket provides market leading electrical performance for all reliability testing requirements. The modularity provides unmatched design flexibility and ensures no sacrifices are made in delivering a complete solution without compromising performance or reliability.

Exhibitions

Meet this supplier at the following exhibition(s):

SEMICON CHINA 2025

26-28 Mar 2025 Shanghai (China)

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    HANNOVER MESSE 2025
    HANNOVER MESSE 2025

    31 Mar - 04 Apr 2025 Hannover (Germany)

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    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.