Spring contact probe H-Pin®

The H-Pin is a stamped spring probe with the mechanical, electrical, and thermal performance of a spring probe, and the ease of use and high volume manufacturability of a stamped contact. The H-Pin serves applications without the typical compromises that are generally required when considering cost versus performance. Features & Benefits - Compliancy for large package warpage - Stable contact resistance and force - Solid beam electrical performance - Compliancy at high temperatures (180 °C) - Correlated bi, system evaluation and test - Reliable power and ground contact - Stocked inventory and better lead time - High volume capacity, quality control, and ease of use Feature Options - 0.40 mm to 0.70 mm travel - Flat-spring rate - BeCu H-Pin - Stainless steel core spring - Bandwidth –1dB @ 15 GHz - Current carrying capacity - High-volume stamping - Reel-to-reel pin insertion Overview Excellent mechanical and electrical performance. Utilizing high volume BeCu stamping technology, combined with a stainless steel spring for mechanical travel, the H-Pin has a working range up to 0.70 mm with a flat spring rate and can be utilized up to 15 GHz with –1.0 dB loss, carry up to 4 A of current and withstand temperatures up to 200 °C.