Burn-in test socket ES Micro Series H-Pin®

Burn-in test socket - ES Micro Series H-Pin® - Smiths Interconnect
Burn-in test socket - ES Micro Series H-Pin® - Smiths Interconnect
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Characteristics

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burn-in

Description

ES Micro Series Socket is a technological advancement in the burn-in socket segment, with a dual latch clamshell lid to provide co-planar pressure on the DUT when the lid is actuated. The inclusion of the patented H-Pin contact technology in the ES Micro-Series socket provides market-leading electrical performance in the smallest footprint for the highest possible parallelism on a burn-in board. This series is compatible with standard heaters and temperature sensors. Features & Benefits - Configurable design, In-house tooling and molds allow for the lowest cost of test. - An extensive catalog of standard parts reduces cost and lead time. - Double-latching clamshell provides ease of use during operation and clearance for lid operation. - Exceptional electrical performance provides wide RF bandwidth. Feature Options - LGA, BGA, and package on package - Spring loaded plunger - Heat sink - HAST venting features - Integrated thermal control with heater and sensor - Reverse seating plane - Max component clearance under the DUT - High temperature materials for above 200 °C applications

Exhibitions

Meet this supplier at the following exhibition(s):

SEMICON CHINA 2025

26-28 Mar 2025 Shanghai (China)

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    HANNOVER MESSE 2025
    HANNOVER MESSE 2025

    31 Mar - 04 Apr 2025 Hannover (Germany)

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    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.