Reflow soldering oven WP-5500

semi-automaticfor PCB

SMTmax reflow oven family of high-throughput thermal processing system is globally famous for the standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. SMTmax WP-5500 systems allow optimized lead-free processing for the ultimate in productivity and efficiency. The features of WP-5500 reflow oven like closed loop convection control provides precise heating and cooling and programmable heat transfer. The cost of ownership for the oven is the lowest in the industry. With five top and five bottom heating zones and 1 top and 1 bottom cooling zone, it can attain a maximum temperature of 400C. It is equipped with fully convection and double conveyors (mesh and rail both). The system comes with a computer control and touch screen, simplified user interface and incredible self calibration capabilities. The power consumption is 220V/60 Hz, 30KW. The dimensions are 3200X900X1400mm (126X36X55 inches). Parameters included: Computerized independent Temperature Control system for Each Zone The SMTmax WP-5500 reflow oven's heating zone temperature are controlled by an accuracy of ±1°C closed loop controller in conjunction with a high-speed longer shaft designed blower adjacent to each heat source for maximum convection, ensure a ±2°C across the PCB assembly. The WP Series diffuser design using pressurized multi-jet technology to ensure a uniform hot air distribution, low-velocity, low-turbulence air flow to prevent component shift or disturbance, and provide heating zone do not interfere each others as well.