1. ESD safe design.
2. PID controlled closed loop of sensor, rapid heating, precise and stable temperature.
3. Suitable for soldering and desoldering surface mounted with ICs, such as QFP, PLCC, SOP, BGA etc.
4. Intelligent cooling system, deferred air delivery when unit is off, auto power off when temperature drops below 100℃.
5. Low vibration, free noise.