Soldering hot plate QK853ESD

Soldering hot plate - QK853ESD - SMT MAX
Soldering hot plate - QK853ESD - SMT MAX
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Characteristics

Applications
soldering

Description

Fast heat up, 10 seconds to reach 250°C. ● Built in temperature sensor for stable temperature control. ● Hot and cool air selection for chip preheating or cooling. ● Used together with a hot air rework station and fixture for BGA and other IC's. ● Power: 460W. ● Temperature: 120°C to 250°C(at nozzle). ● Air volume: 0.18 cubic meter/min. ● Size: 100(W) x60 (H) x170 (D) mm. ● Weight: 1kg.

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