Fast heat up, 10 seconds to reach 250°C.
● Built in temperature sensor for stable temperature control.
● Hot and cool air selection for chip preheating or cooling.
● Used together with a hot air rework station and fixture for BGA and other IC's.
● Power: 460W.
● Temperature: 120°C to 250°C(at nozzle).
● Air volume: 0.18 cubic meter/min.
● Size: 100(W) x60 (H) x170 (D) mm.
● Weight: 1kg.