ICP-OES spectrometer GREEN
optical emissioninductively coupled plasmameasurement

ICP-OES spectrometer
ICP-OES spectrometer
ICP-OES spectrometer
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Characteristics

Type
optical emission, ICP-OES, inductively coupled plasma
Domain
measurement, laboratory, process, for analysis, for fuel, oil-in-water, for spectroscopy, chemistry, optical, fast, industrial, for food analysis, for the pharmaceutical industry, for the food industry, for oil industry applications, for the environmental industry, for production, for the petrochemical industry
Configuration
compact
Detector type
CCD
Other characteristics
high-resolution, high-sensitivity, high-precision
Wavelength

Max.: 770 nm

Min.: 165 nm

Description

SPECTROGREEN inductively coupled plasma optical emission spectrometer (ICP-OES) available in 3 versions: revolutionary Dual Side-On Interface (DSOI), Twin Interface (TI) or Side-On-Plasma (SOP) technology OVERVIEW New revolutionary Dual Side-On Interface (DSOI) technology that achieves twice the sensitivity of conventional radial-plasma-view instruments TI technology enables highest sensitivity for trace elements, as well as freedom from matrix interferences plus good accuracy for challenging environmental matrices New GigE readout system that enables spectra transport in less than 100 ms for faster analysis speeds, shorter sample-to-sample times, and more samples per hour Extremely agile, LDMOS generator that makes external cooling unnecessary: analyze difficult sample matrices in lower dilutions for lower limits of detection — faster warmup (~10 minutes) for higher productivity SPECTRO’s new DSOI technology, a brand-new approach to the critical issue of plasma view design, uses a vertical plasma torch, observed via a new direct radial-view technology. Two optical interfaces capture emitted light from both sides of the plasma, using only a single extra reflection, for added sensitivity and elimination of issues plaguing newer vertical-torch dual-view models. As a result, DSOI provides twice the sensitivity of conventional radial systems — yet avoids the complexity, drawbacks, and cost of vertical dual view models. The Twin Interface model automatically combines both axial and radial plasma views — looking both across the plasma and from end-to-end — optimizing sensitivity, linearity, and dynamic range while avoiding matrix effects like EIE.

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