The 20B-5P-4D is the latest specification for double side polishing of 300mm or 200mm wafers. With un-paralleled stability this system mass-produces 15 each 200mm wafers per batch, and 5 each 300mm wafers per batch. This is the ideal system for high flatness, low Nanotopography automation, maintenance and cost of ownership. The 20B05P-4D meets the most severe demands for precision and roll-off.