Thermal pads (TIM) are silicone materials loaded with thermally conductive particles. They are used to fill the spaces of several millimeters between a heat spreader and one or more electronic components.The flexibility of thermal PAD also helps to compensate for different heights of components to a printed circuit .Versions without silicone are available for sensitive applications (automotive, optical).
Applications :
- Automotive modules, transmission controls
- Telecommunications
- Processors
- Wireless communications hardware
- Power conversion
- Battery pack and Battery management system BMS