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Ultra-high vacuum micro-positioning system MP105-3 series
3-axisXYZpiezo

Ultra-high vacuum micro-positioning system - MP105-3 series - Steinmeyer Mechatronik GmbH - 3-axis / XYZ / piezo
Ultra-high vacuum micro-positioning system - MP105-3 series - Steinmeyer Mechatronik GmbH - 3-axis / XYZ / piezo
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Characteristics

Number of axes
3-axis, XYZ
Features
piezo
Applications
for clean rooms, for hygienic applications, for the semiconductor industry, for wafer inspection and metrology, optical beam, vacuum, for geometric alignments
Other characteristics
compact, ultra-high vacuum, crossed roller bearing, for granite slabs, high-resolution

Description

Fast, precise micropositioner • HV / UHV / EUV, 20 - 50 mm travel, 0.2 µm repeatability, 1 kg load • Vacuum: all ranges HV / UHV / EUV • Lubrication liquid up to 10E-8 / dry up to 10E-11 mbar • Max. Bakeout temperature: 120°C Optionally configurable: • Available as magnetic, low-magnetic and magnet-free versions • Different motor variants: Piezo motor or nanomotion • Optionally with high-resolution measuring system for repeatability up to 0.005 µm • Can be combined with rotary tables for rotary applications • Individual adaptation to the installation situation in the chamber • Version for clean room ISO 14644-1 (up to class 1 on request) • Optionally with controller FMC400/450 Miniaturized XYZ manipulator for high precision or dynamic applications The manipulator is a highly dynamic 3-axis system for X, Y and Z movement in very limited installation space. Strokes up to 50 mm are realized. The manipulator is equipped with piezo motors and can thus realize positioning increments of a few nanometers for high-precision applications in high vacuum and ultra-high vacuum. Optionally equipped with a nanomotion, it is particularly suitable for highly dynamic and high-precision positioning. Application areas Precision positioning in very small spaces for laboratory applications, microscopy and semiconductor technology, research in ultra-high vacuum and under extreme ultraviolet radiation, sample preparation, sample scanning, sample handling, camera adjustment, sensor adjustment, materials research, materials analysis, beamline, accelerator, synchrotron, miniaturization

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