Layer count: 18
Board thickness:4.0mm
Dimension:30.98*25.2mm
Raw material:FR4 EM827
Copper thickness on the board surface:140um
Copper thickness in the hole barrel:70um
Min.line width/space:0.3mm
Minimum hole diameter:0.4mm
Surface finishing:immersion gold≥2u"
Application:tablet power supply
Special numerical controlled routing machine can meet customer's requirement of half hole design.
100% low resistance test for better
stability of your power supply products.
Advanced facility of VCP plating line brings you excellent uniformity of plating result:
inner/outer layer copper thickness: 4oz;
via copper thickness≥70um