Multilayer printed circuit board M40C23268

prepreg PCB40 layers

Unique SLPS ERP system enables us to monitor the entire production process in the palm. Our specialized Burkle pressing machine provides excellent accuracy of lamination pressing temperature curve and prevents resin over-flowing. 4oz of inner layer copper thickness is guaranteed. We have customized plasma desmear machine and VCP plating line to provide excellent uniformity of via copper plating Advanced Hitachi drilling machine meets your strict via positioning spec of ±0.05mm; 100% electrical resistance test guarantees excellent stability performance. Board thickness：3.0mm Dimension：158*83.21mm Raw material：FR4 TG170 tuc Copper thickness on the board surface：140um Copper thickness in the hole barrel：50um Min.line width/space：0.30mm Minimum hole diameter：0.4mm Surface finishing：immersion gold≥1u" Application：telecom power supply